Panasonic and the service life of semiconductor packages during operation at high temperatures

A new momentum for Panasonic Corporation with the commercialization of the encapsulation molding compound (EMC) for copper wire bonding. This material can help improve the reliability and extend the service life of semiconductor packages during operation at high temperatures.

Copper wire applicable sulfur-free encapsulation molding compound.

One can discover that, Copper bonding wires have increasingly been used in semiconductor packages because copper is characterized by high joint reliability in high temperature environments, and has a stable market price compared to gold.

Applications include: Semiconductor packages for copper wire bonding for consumer products, industrial equipment (e.g. robots), in-vehicle products (e.g. ECUs), etc.